Report: TSMC can run a joint venture with partners to run Fabs Intel

Taiwan Semiconductor Co. It can create a joint venture with several chips manufacturers to support Fabs Intel Corp., Reuters Reported Today.

It is claimed that the corporate gave the concept of ​​nvidia corp., Advanced Micro Devices Inc., Broadcom Inc. and Qualcomm Inc. As a part of the plan, chip manufacturers would participate in a joint undertaking, whose task is to support Fabs Intel. TSMC, who reportedly looks at a share of up to 50%, could be accountable for day by day plant management.

Intel is within the face of competition on the fundamental market and last 12 months noted a lack of $ 18.8 billion. Company efforts geared toward increasing business results could apparently see how they sell some business units. In August, the news appeared that the Intel Management Board has weighed Divided project groups and foundry as a part of the initiative.

Reports that TSMC may strive to buy a Foundry group for the primary time last month. According to Reuters, the concept was originally floated before the corporate was announced Plan $ 100 billion To construct a recent FAB within the USA, TSMC apparently continues to discuss to participate in Intel factories through a joint venture.

It is believed that the Intel 18A production process is a “area of ​​competition” in conversations with TSMC. The technology that’s to introduce a mass process within the second half of the 12 months is a significant improvement compared to the corporate’s previous processes. During the discussions that took place last month, Intel directors reportedly told TSMC that 18A is more advanced than the most recent technology of two nanometers of this latter company.

One of the major innovations in 18A is a function called power supply. Usually small wires transferring electricity to the processor circuits are positioned above its transistors. The supply of rear power moves these cables below the transistors, which increases the processing speeds and reduces energy consumption.

The chips made using the Intel 18A process will even implement a gate transistor project. The most noteworthy feature of the project is that the gate, the component accountable for the management of electricity flow, is surrounded by a transistor to which it’s attached from all sides. This reduces the electricity leakage from the transistor, and thus improves energy efficiency.

NVIDIA, AMD and Broadcom, three firms that TSMC have made their proposal to a joint undertaking, supposedly study the potential for using 18A for processing. Chipmakers are also TSMC clients.

There are significant technical differences between TSMC and Intel Fabs. Companies buy a significant a part of the equipment for making tops from the identical suppliers, but they don’t configure their production lines in the identical way. According to Reuters, the answer to the challenges brought on by these technical differences may require TSMC to invest significant resources within the proposed joint undertaking.

Photo: TSMC