The Los Alamos National Laboratory (LANL) conducts a project to transform the approach to designing and producing chip systems to make them more energy -saving and able to higher tolerate environmental conditions resembling radiation.
New Mexico Research and Development Laboratory It will mix its own Nano Solutions on Chip (NSOC) project with three others in a new center of scientific research of microelectronics (MSRC) called Chime, which suggests an element and heterogeneous integration of microelectronics for extreme environments.
NSOC will give attention to nanoskala semiconductors, resembling quantum dots, to create devices using photons and electrons for transferring information. The research consists in arranging electronic and photonic components in three -dimensional structures, which, according to LANL scientists, will solve a few of these energy and production challenges and may lead to greater tolerance of radiation effects.
Radiation may cause havoc with normal semiconductors, because charged particles will interfere with the normal functioning of circuits, requiring them rigorously protected or hardened in environments where radiation will probably be present.
“This project aims to solve a key problem in electronics that due to the dependence on electrons, because information carriers, integrated circuits reach the limits of density, speed and distance of bandwidth,” explained Jennifer Hollingsworth, scientist and laboratory worker at the center for the center for integrated nanotechnology center (Cint), which is heading at NSOC and can be the first chairman of the bell.
“The complexity required to take into account improvements in integrated circuits means up to 30 miles of cables sending electrical data to 10 or more different levels of the system, all produced by increasingly inefficient production processes,” she said.

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Other projects in the center will encounter various challenges to optimize performance, including heterogeneous integration, wherein the components are produced individually, after which combined right into a single system. According to LANL, projects will develop and examine the effectiveness of varied materials, processes and technologies that will be used to produce systems.
Adam Rondinone, co -director Cint, said that the Chime Center goals to fill the “laboratory for FAB” observed in the progress of semiconductor technology in order that its research could translate into scalable technology so as to meet critical social and industrial needs.
This fear was one in all the Department of Defense (DU) he also tried to solve pumped $ 238 million To several Commons Regional Innovation Hubs microelectronics in 2023, along with the then deputy secretary of defense secretary Kathleen Hicks, describing the gap “Laboratory to Fab” as “the infamous Death Valley between R&D and production”.
University of Pennsylvania, Columbia University, University of Wisconsin-Madison, Duke University and Sandia National Laboratories are also partners from LANL on the NSOC project.
Lanl confirmed that he was cooperating last week Openai To implement it O1 LLM with the possibility of reasoning on the laboratory Deer To discover new approaches to the treatment of diseases, protect the power grid, increase the US cybernetic safety and work on high energy physics studies.
Supported by Microsoft Maker AI already had a distinct project in work from the laboratoryIt began in 2024 to examine the use of AI in biionaucus, including the risk assessment related to this when artificial intelligence is used to develop gasoline.
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